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Serrated Rubber Contact Belt Wheel Polishing Rubber Contact Wheel for Belt Grinder
RUIZUAN rubber contact wheel is made of rubber and aluminum. The rubber is wear-resistant, compressive, non-adhesive, and has strong adhesion between the rubber and the aluminum core and has a long service life. The hub is made of aluminum, with 7R8 bearings inside, and the bearing holes have high precision.
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Electroplated Diamond CBN Grinding Wheels CBN Grinding Disc for Spring Grinding
RUIZUAN spring end grinding wheels have been developed with specially selected premium quality grains suitable for spring end grinding. The super-abrasive particles are held in place by a strong nickel layer of bond that provides superior wear resistance. This unique formulation allows wheel to grind millions of springs without burning and meet demands for higher grinding performance (>6 times more parts per wheel*), less waste and up to 10 times longer product life.
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Aluminium Oxide Spring Nut Grinding Wheel Spring End Grinding Wheel
Three ways to grind spring: Manual grinding, semi-automatic grinding and automatic grinding.
There are two types of spring end grinding machine: One is a horizontal grinding machine, the other is a vertical grinding machine -
6A2T LED Substrate Metal Bond Back Grinding Wheel Diamond Grinding Wheel
The diamond back grinding wheel is widely used in the electronics industry such as LED chips and integrated circuit silicon wafers, which is mainly for back thinning and grinding semiconductor wafers.Diamond grinding wheels are the only option.
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12A1 Wafer hub dicing saw blade Diamond Dicing Blades For Wafer Scribing
Diamond dicing blade is used for grooving , cutting silicon wafer, compound semiconductors, glass and other materials in electronic information industry. Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade. The binders include resin bond dicing blade, metal bond dicing blade and electroformed nickel dicing blade.This type is electroplated.
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Metal bond Diamond Grinding Wheels Silicon Wafer Chamfering Edge Grinding Wheel
Metal bond wheels and resin bond wheels are used in edge grinding on the outer circumference of sillicon wafers, which requires uniform sharpness in addition to precision accuracy in the shape of the wheel and abrasion resistance.
Both outer-circumference machining and notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing -
Resin Bond Micro Dicing Blades for Precision Cutting and Slotting for Semiconductor
Diamond dicing blades are mainly used in the precision manufacturing industry.
According to the structure, it can be divided into the soft blade and hard blade. Generally, the circular sheet grinding wheel is called “soft blade” and the combination of the grinding wheel and the aluminum alloy tool holder is called “hard blade”.
According to bond, it is divided into metal bond, resin bond, electroplated bond diamond dicing blade. -
LED Substrate Back Grinding Wheels Silicon Wafer Thinner Grinding Wheels for Photovoltaic Industry
A silicon wafer grinding wheel is a specialized tool used in the semiconductor industry for thinning and shaping silicon wafers. Silicon wafers are used as a substrate for the fabrication of integrated circuits and other electronic components.
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Vitrified Bond CBN Internal Grinding Wheels for Compressor Parts Grinding
Vitrified bond CBN internal grinding wheels are widely used in air-conditioning compressors, auto parts and other industries, such as compressor pistons, cylinders, cylinder heads, bearings, gears and other internal hole grinding. CBN internal grinding wheel is suitable for various ultra-high precision internal hole grinding, the grinding wheel has an open structure and good self-sharpening.