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Metal bond Diamond Grinding Wheels Silicon Wafer Chamfering Edge Grinding Wheel

Metal bond Diamond Grinding Wheels Silicon Wafer Chamfering Edge Grinding Wheel Featured Image
  • Metal bond Diamond Grinding Wheels Silicon Wafer Chamfering Edge Grinding Wheel
  • Metal bond Diamond Grinding Wheels Silicon Wafer Chamfering Edge Grinding Wheel
  • Metal bond Diamond Grinding Wheels Silicon Wafer Chamfering Edge Grinding Wheel
  • Metal bond Diamond Grinding Wheels Silicon Wafer Chamfering Edge Grinding Wheel

Short Description:

Metal bond wheels and resin bond wheels are used in edge grinding on the outer circumference of sillicon wafers, which requires uniform sharpness in addition to precision accuracy in the shape of the wheel and abrasion resistance.
Both outer-circumference machining and notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing


Product Detail

Product Tags

Application of edge grinding wheel:

Edge grinding wheel, chamfering wheels for sapphire substrate, silicon carbide substrate and silicon wafer, liquid crystal panel, ITO glass, PDP glass, quartz glass, microcrystalline glass, photovoltaic glass, automotive glass.

Product Name
Edge grinding wheel
Bonding
Resin or metal
Application
For Semiconductor Material Processing
Size
50-250mm，325-3000 grit
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1.Grinded with uniform chamfer width, excellent rigidity
2.Strong groove shape retention, long life
3.By edge grinding the final diameter is adjusted
4.A uniform diamond layer minimizes machining damage
5.Highly precise slotted shape support various wafer shapes

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We also offer best-in-class tolerances on groove angles, blunts, and radii for world-class performance on silicon, sapphire, SiC, or any other wafer material

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