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Aluminium Oxide Spring Nut Grinding Wheel Spring End Grinding Wheel
Three ways to grind spring: Manual grinding, semi-automatic grinding and automatic grinding.
There are two types of spring end grinding machine: One is a horizontal grinding machine, the other is a vertical grinding machine -
6A2T LED Substrate Metal Bond Back Grinding Wheel Diamond Grinding Wheel
The diamond back grinding wheel is widely used in the electronics industry such as LED chips and integrated circuit silicon wafers, which is mainly for back thinning and grinding semiconductor wafers.Diamond grinding wheels are the only option.
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12A1 Wafer hub dicing saw blade Diamond Dicing Blades For Wafer Scribing
Diamond dicing blade is used for grooving , cutting silicon wafer, compound semiconductors, glass and other materials in electronic information industry. Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade. The binders include resin bond dicing blade, metal bond dicing blade and electroformed nickel dicing blade.This type is electroplated.
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Metal bond Diamond Grinding Wheels Silicon Wafer Chamfering Edge Grinding Wheel
Metal bond wheels and resin bond wheels are used in edge grinding on the outer circumference of sillicon wafers, which requires uniform sharpness in addition to precision accuracy in the shape of the wheel and abrasion resistance.
Both outer-circumference machining and notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing -
Resin Bond Micro Dicing Blades for Precision Cutting and Slotting for Semiconductor
Diamond dicing blades are mainly used in the precision manufacturing industry.
According to the structure, it can be divided into the soft blade and hard blade. Generally, the circular sheet grinding wheel is called “soft blade” and the combination of the grinding wheel and the aluminum alloy tool holder is called “hard blade”.
According to bond, it is divided into metal bond, resin bond, electroplated bond diamond dicing blade. -
LED Substrate Back Grinding Wheels Silicon Wafer Thinner Grinding Wheels for Photovoltaic Industry
A silicon wafer grinding wheel is a specialized tool used in the semiconductor industry for thinning and shaping silicon wafers. Silicon wafers are used as a substrate for the fabrication of integrated circuits and other electronic components.
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Vitrified Bond CBN Internal Grinding Wheels for Compressor Parts Grinding
Vitrified bond CBN internal grinding wheels are widely used in air-conditioning compressors, auto parts and other industries, such as compressor pistons, cylinders, cylinder heads, bearings, gears and other internal hole grinding. CBN internal grinding wheel is suitable for various ultra-high precision internal hole grinding, the grinding wheel has an open structure and good self-sharpening.
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Vitrified Bond Diamond Wheel Back Grinding Wheel for Surface Grinding Silicon Wafer
Back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our institute which possess superior grinding performance and high cost.
Performance are among the top level worldwide. They can be used with the Japanese, German, American, Korean and Chinese grinders. -
Vitrified CBN Grinding Disc Wheels Double End Face Grinding Wheel
Vitrified Diamond CBN Double Disc Wheels is made of grinding disc matrix and super hard diamond grinding pellets by epoxy resin adhesive, and can be made into various shapes such as regular hexagon, sector, square ,circular, trigonometrical, hexagonal pellets (other shapes can be customized).