Resin Bond Micro Dicing Blades for Precision Cutting and Slotting for Semiconductor

Short Description:

Diamond dicing blades are mainly used in the precision manufacturing industry.
According to the structure, it can be divided into the soft blade and hard blade. Generally, the circular sheet grinding wheel is called “soft blade” and the combination of the grinding wheel and the aluminum alloy tool holder is called “hard blade”.
According to bond, it is divided into metal bond, resin bond, electroplated bond diamond dicing blade.

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Product Detail

Product Tags

Resin bond diamond dicing blades(soft blades) has good elasticity, self-sharpening, sharp cutting, good cutting quality
Metal bond diamond dicing blades (soft blades) have high strength, good rigidity, long life
Electroplated bond diamond dicing blades (soft blades) feature high strength, good rigidity, good shape retention and long service life.

Type	General shape	Diameter (mm)	Thickness (mm)	Thickness tolerance (mm)	Grain grit size
Metal bond No steel core	1A8, 1A8S	10 ~ 200	0.05 ~ 4.00	±0.002 / ±0.005	100# ~ 3000#
Resin bond No steel core	1A8, 1A8S	50 ~ 153	0.06 ~ 4.00	±0.005 / ±0.008	100#~2000#
Nickel bond Hubless blades	1A8, 1A8S	50 ~ 120	0.02 ~ 0.50	±0.005 / ±0.010	200# ~ 4000#
With Steel core	1A1, 1A1R, 1A1S, 1A1RS	50-400	0.25 ~ 6.00	±0.010 / ±0.020	100# ~ 2000#
Nickel bond Hub blades	3A1, 3A1S	50 ~ 58	0.01 ~ 0.12	±0.005 / ±0.010	320# ~ 5000#

1.Metal bond dicing balde
Application: Scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, PCB, ceramic, glass, quartz, crystal, ferrite, optical communication (Faraday), etc
2.Resin bond dicing blade
Application: cutting scribing glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), BGA, QFN （copper epoxy molding ), splitter, sapphire, ceramic substrate, alumina, aliminum nitride, etc
3.Electroformed dicing balde
Application: Scribing dicing silicon wafers, copper wafer and compound semiconductor wafers ( such as GaAs and SiC) , resistance, ceramic, packaging materials, lithium niobate, lithium tantalate, etc